- Product Name: Alumina Substrate(ST)
- Product Features: High flexural strength, high insulation, large size, and laser-processable
- Application Ccenarios: Thick-film integrated circuits, insulating heat sinks, semiconductor cooling sheets, high-power semiconductor modules, motor controllers for new energy vehicles, IGBT modules, photovoltaic inverters
Alumina Substrate(ST)
Performance Parameters
| Material Grade | ST | |||
| Content of Al2O3 | wt | % | >96% | |
| Appearance | White | |||
| Roughness | Ra | μm | 0.2~0.6 | |
| Density | Drainage | g/cm3 | ≥3.70 | |
| Light Reflectance | 450nm/1mm | % | 94 | |
| Mechanical Characteristics | Flexural Strength | Three Point Bending Resistance | MPa | ＞380 |
| Fracture Toughness | Indentation Method | MPa.m½ | 3.0 | |
| Vickers Hardness | Load 4.9N | GPa | 14 | |
| Young's Modulus | Stretching Method | Gpa | 330 | |
| Thermal Characteristics | Coefficient of Linear Thermal Expansion | 25~800℃ | x10-6 /K |
7.8 |
| Thermal Conductivity | 25℃ | W/(m.k) | ＞22 | |
| Specific Heat Capacity | 25℃ | J/(kg.k) | 750 | |
| Electrical Characteristics | Dielectric Constant | 1MHz,25℃ | - | 9.4 |
| Dielectric Loss Angle | 1MHz,25℃ | x10-4 | ≤3 | |
| Volume Resistivity | 25℃ | Ω.cm | ≥10¹⁴ | |
| Dielectric Strength | DC | KV/mm | ≥15 | |
