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Product Name: Alumina Ceramic Substrate (HR, High Reflectivity)
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Product Features: High visible light reflectivity, high flexural strength, high insulation, large size, and laser-processable
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Application Scenario: COB packaging of LED chips
Product Name: Alumina Ceramic Substrate (HR, High Reflectivity)
Product Features: High visible light reflectivity, high flexural strength, high insulation, large size, and laser-processable
Application Scenario: COB packaging of LED chips
| Material Grade | HR | |||
| Content of Al2O3 | wt | % | >90% | |
| Appearance | White | |||
| Roughness | Ra | μm | 0.2~0.5 | |
| Density | Drainage | g/cm3 | ≥3.75 | |
| Light Reflectance | 450nm/1mm | % | 98 | |
| Mechanical Characteristics | Flexural Strength | Three Point Bending Resistance | MPa | >380 |
| Fracture Toughness | Indentation Method | MPa.m½ | 3.0 | |
| Vickers Hardness | Load 4.9N | GPa | 14 | |
| Young's Modulus | Stretching Method | Gpa | 330 | |
| Thermal Characteristics | Coefficient of Linear Thermal Expansion | 25~800℃ | x10-6 /K |
7.7 |
| Thermal Conductivity | 25℃ | W/(m.k) | >22 | |
| Specific Heat Capacity | 25℃ | J/(kg.k) | 750 | |
| Electrical Characteristics | Dielectric Constant | 1MHz,25℃ | - | 9.4 |
| Dielectric Loss Angle | 1MHz,25℃ | x10-4 | ≤3 | |
| Volume Resistivity | 25℃ | Ω.cm | ≥10¹⁴ | |
| Dielectric Strength | DC | KV/mm | ≥15 | |
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