- Product Description: Alumina Ceramic Substrate (HP, High Cost Performance)
- Product Features: High density, high flexural strength, high cost performance, high insulation, high thermal conductivity, large size, and laser processable
- Application Scenarios: Thick-film integrated circuits, thin-film integrated circuits, insulating heat sinks, DBC copper clad laminates, high-power semiconductor modules, motor controllers for new energy vehicles, IGBT modulesa
Alumina Substrate(HP)
Performance Parameters
| Material Grade | HP | |||
| Content of Al2O3 | wt | % | >99.3% | |
| Appearance | Light yellow | |||
| Roughness | Ra | μm | 0.1~0.3 | |
| Density | Drainage | g/cm3 | ≥3.90 | |
| Light Reflectance | 450nm/1mm | % | 90 | |
| Mechanical Characteristics | Flexural Strength | Three Point Bending Resistance | MPa | ＞470 |
| Fracture Toughness | Indentation Method | MPa.m½ | 3.2 | |
| Vickers Hardness | Load 4.9N | GPa | 15 | |
| Young's Modulus | Stretching Method | Gpa | 350 | |
| Thermal Characteristics | Coefficient of Linear Thermal Expansion | 25~800℃ | x10-6 /K |
7.8 |
| Thermal Conductivity | 25℃ | W/(m.k) | ＞28 | |
| Specific Heat Capacity | 25℃ | J/(kg.k) | 70 | |
| Electrical Characteristics | Dielectric Constant | 1MHz,25℃ | - | 9.8 |
| Dielectric Loss Angle | 1MHz,25℃ | x10-4 | ≤2 | |
| Volume Resistivity | 25℃ | Ω.cm | ≥10¹⁴ | |
| Dielectric Strength | DC | KV/mm | ≥15 | |
