- Product Description: Alumina Ceramic Substrate (A-99.9)
- Product Features: low roughness, high volume resistivity, high density, high flexural strength, high insulation, high thermal conductivity, and capable of laser processing
- Application Scenarios: Thin-film integrated circuits, high-power semiconductor modules, semiconductor equipment components, motor controllers for new energy vehicles, IGBT modules
Alumina Substrate(A-99.9)
Performance Parameters
| Material Grade | A-99.9 | |||
| Content of Al2O3 | wt | % | >99.9% | |
| Appearance | White | |||
| Roughness | Ra | μm | 0.1~0.2 | |
| Density | Drainage | g/cm3 | ≥3.90 | |
| Light Reflectance | 450nm/1mm | % | / | |
| Mechanical Characteristics | Flexural Strength | Three Point Bending Resistance | MPa | ＞500 |
| Fracture Toughness | Indentation Method | MPa.m½ | 3.2 | |
| Vickers Hardness | Load 4.9N | GPa | 16 | |
| Young's Modulus | Stretching Method | Gpa | 350 | |
| Thermal Characteristics | Coefficient of Linear Thermal Expansion | 25~800℃ | x10-6 /K |
7.9 |
| Thermal Conductivity | 25℃ | W/(m.k) | ＞29 | |
| Specific Heat Capacity | 25℃ | J/(kg.k) | 728 | |
| Electrical Characteristics | Dielectric Constant | 1MHz,25℃ | - | 9.8 |
| Dielectric Loss Angle | 1MHz,25℃ | x10-4 | ≤2 | |
| Volume Resistivity | 25℃ | Ω.cm | ≥1016 | |
| Dielectric Strength | DC | KV/mm | ≥15 | |
