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Product Description: Alumina Ceramic Substrate (A-99)
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Product features: High density, high flexural strength, high cost performance, high insulation, high thermal conductivity, large size, and laser processable
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Application scenarios: thick-film integrated circuits, thin-film integrated circuits, insulating heat sinks, burning gaskets, DBC copper clad laminates, high-power semiconductor modules, motor controllers for new energy vehicles, IGBT modules
Alumina Substrate(A-99)
Performance Parameters
| Material Grade | A-99 | |||
| Content of Al2O3 | wt | % | >99% | |
| Appearance | Light yellow | |||
| Roughness | Ra | μm | 0.15~0.4 | |
| Density | Drainage | g/cm3 | ≥3.80 | |
| Light Reflectance | 450nm/1mm | % | 85 | |
| Mechanical Characteristics | Flexural Strength | Three Point Bending Resistance | MPa | ＞400 |
| Fracture Toughness | Indentation Method | MPa.m½ | 3.2 | |
| Vickers Hardness | Load 4.9N | GPa | 15 | |
| Young's Modulus | Stretching Method | Gpa | 350 | |
| Thermal Characteristics | Coefficient of Linear Thermal Expansion | 25~800℃ | x10-6 /K |
7.9 |
| Thermal Conductivity | 25℃ | W/(m.k) | ＞27 | |
| Specific Heat Capacity | 25℃ | J/(kg.k) | 780 | |
| Electrical Characteristics | Dielectric Constant | 1MHz,25℃ | - | 9.8 |
| Dielectric Loss Angle | 1MHz,25℃ | x10-4 | ≤3 | |
| Volume Resistivity | 25℃ | Ω.cm | ≥1015 | |
| Dielectric Strength | DC | KV/mm | ≥15 | |
